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LT18DP1911 - Laird Technologies EMI - RFI and EMI - Contacts, Fingerstock and Gaskets

LT18DP1911

Laird Technologies EMI

CP,OTH, OCP BP 2.75X7.94X10.50MM

LT18DP1911 is a RFI and EMI - Contacts, Fingerstock and Gaskets manufactured by Laird Technologies EMI. CP,OTH, OCP BP 2.75X7.94X10.50MM. Key specifications: material Beryllium Copper.

In Stock: 22

Product Attributes

AttributeValue
Product StatusActive
TypeFingerstock
Shape-
Width0.276" (7.00mm)
Length0.398" (10.10mm)
Height0.108" (2.75mm)
MaterialBeryllium Copper
PlatingTin
Plating - Thickness299.99µin (7.62µm)
Attachment MethodClip
Operating Temperature-

Frequently Asked Questions

LT18DP1911 is a RFI and EMI - Contacts, Fingerstock and Gaskets manufactured by Laird Technologies EMI. CP,OTH, OCP BP 2.75X7.94X10.50MM

The material of LT18DP1911 is Beryllium Copper.

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