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67BCG2003201508R00 - Laird Technologies EMI - RFI and EMI - Contacts, Fingerstock and Gaskets

67BCG2003201508R00

Laird Technologies EMI

SP,CON,C,AU,TNR

67BCG2003201508R00 is a RFI and EMI - Contacts, Fingerstock and Gaskets manufactured by Laird Technologies EMI. SP,CON,C,AU,TNR. Key specifications: material Beryllium Copper.

In Stock: 4,268

Product Attributes

AttributeValue
Product StatusActive
TypeFingerstock
Shape-
Width0.078" (2.00mm)
Length0.126" (3.20mm)
Height0.059" (1.50mm)
MaterialBeryllium Copper
PlatingGold
Plating - Thickness-
Attachment MethodSolder
Operating Temperature-

Frequently Asked Questions

67BCG2003201508R00 is a RFI and EMI - Contacts, Fingerstock and Gaskets manufactured by Laird Technologies EMI. SP,CON,C,AU,TNR

The material of 67BCG2003201508R00 is Beryllium Copper.

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