67BCG2003201508R00
SP,CON,C,AU,TNR
67BCG2003201508R00 is a RFI and EMI - Contacts, Fingerstock and Gaskets manufactured by Laird Technologies EMI. SP,CON,C,AU,TNR. Key specifications: material Beryllium Copper.
In Stock: 4,268
SP,CON,C,AU,TNR
67BCG2003201508R00 is a RFI and EMI - Contacts, Fingerstock and Gaskets manufactured by Laird Technologies EMI. SP,CON,C,AU,TNR. Key specifications: material Beryllium Copper.
In Stock: 4,268
| Attribute | Value |
|---|---|
| Product Status | Active |
| Type | Fingerstock |
| Shape | - |
| Width | 0.078" (2.00mm) |
| Length | 0.126" (3.20mm) |
| Height | 0.059" (1.50mm) |
| Material | Beryllium Copper |
| Plating | Gold |
| Plating - Thickness | - |
| Attachment Method | Solder |
| Operating Temperature | - |
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