67B3G2507009010R0B
SP,CON,3,AU,TNR
67B3G2507009010R0B is a RFI and EMI - Contacts, Fingerstock and Gaskets manufactured by Laird Technologies EMI. SP,CON,3,AU,TNR. Key specifications: material Beryllium Copper.
In Stock: 1,681
SP,CON,3,AU,TNR
67B3G2507009010R0B is a RFI and EMI - Contacts, Fingerstock and Gaskets manufactured by Laird Technologies EMI. SP,CON,3,AU,TNR. Key specifications: material Beryllium Copper.
In Stock: 1,681
| Attribute | Value |
|---|---|
| Product Status | Active |
| Type | Fingerstock |
| Shape | - |
| Width | 0.098" (2.50mm) |
| Length | 0.276" (7.00mm) |
| Height | 0.354" (9.00mm) |
| Material | Beryllium Copper |
| Plating | Gold |
| Plating - Thickness | - |
| Attachment Method | Solder |
| Operating Temperature | - |
Submit your RFQ for 67B3G2507009010R0B and get a quote within 24 hours.