RFI EMI GROUNDING MATERIAL 25FT
0C97055002 is a RFI and EMI - Contacts, Fingerstock and Gaskets manufactured by Laird Technologies EMI. RFI EMI GROUNDING MATERIAL 25FT. Key specifications: operating temperature 121°C, material Beryllium Copper.
In Stock: 65
| Attribute | Value |
|---|---|
| Product Status | Active |
| Type | Fingerstock |
| Shape | - |
| Width | 0.230" (5.84mm) |
| Length | 24.000" (609.60mm) |
| Height | 0.030" (0.76mm) |
| Material | Beryllium Copper |
| Plating | Unplated |
| Plating - Thickness | - |
| Attachment Method | Adhesive |
| Operating Temperature | 121°C |
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3J LIMITED
