RFQ List

No items in your RFQ list

Estimated Total: $0.00
View RFQ List
F871AP333M330C - KEMET - Film Capacitors

F871AP333M330C

KEMET

CAP FILM POLYPROP RAD X1

F871AP333M330C is a Film Capacitors manufactured by KEMET. CAP FILM POLYPROP RAD X1. Key specifications: mounting type Through Hole, operating temperature -40°C ~ 110°C, voltage rating - dc 800V, package / case Radial.

In Stock: 4,425

Product Attributes

AttributeValue
Capacitance0.033 µF
Tolerance±20%
Voltage Rating - AC330V
Voltage Rating - DC800V
Dielectric MaterialPolypropylene (PP), Metallized
ESR (Equivalent Series Resistance)-
Operating Temperature-40°C ~ 110°C
Mounting TypeThrough Hole
Package / CaseRadial
Size / Dimension0.512" L x 0.236" W (13.00mm x 6.00mm)
Height - Seated (Max)0.472" (12.00mm)
TerminationPC Pins
Lead Spacing0.394" (10.00mm)
ApplicationsEMI, RFI Suppression
RatingsX1
Features-

Frequently Asked Questions

F871AP333M330C is a Film Capacitors manufactured by KEMET. CAP FILM POLYPROP RAD X1

The mounting type of F871AP333M330C is Through Hole.

The operating temperature range of F871AP333M330C is -40°C ~ 110°C.

The supply voltage of F871AP333M330C is 800V.

The capacitance of F871AP333M330C is 0.033 µF.

Alternative Products

Part NumberManufacturerDescriptionMatch
F339X133333KDI2B0 Vishay Beyschlag/Draloric/BC Components CAP FILM 0.033UF 10% 800VDC RAD 100% View
B32912A3333K289 EPCOS - TDK Electronics CAP FILM 0.033UF 10% 760VDC RAD 99% View
MKP385333100JFI2B0 Vishay Beyschlag/Draloric/BC Components CAP FILM 0.033UF 5% 1KVDC RADIAL 96% View
MKP385333100JC02R0 Vishay Beyschlag/Draloric/BC Components CAP FILM 0.033UF 5% 1KVDC RADIAL 96% View
MKS4J023302E00MF00 WIMA CAP FILM 0.033UF 20% 630VDC RAD 94% View
150333J630EC Cornell Dubilier Electronics (CDE) CAP FILM 0.033UF 5% 630VDC AXIAL 91% View

Related Products

Manufacturers in Film Capacitors

Need a Quote for This Part?

Submit your RFQ for F871AP333M330C and get a quote within 24 hours.

Top
Live Chat
Hello! How can we help you today? Feel free to ask about pricing, availability, or technical details.