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ZSSC3230BI1DES - Renesas Electronics Corporation - Interface - Sensor and Detector Interfaces

ZSSC3230BI1DES

Renesas Electronics Corporation

DICE (WAFER SAWN) - WAFFLE PACK

ZSSC3230BI1DES is a Interface - Sensor and Detector Interfaces manufactured by Renesas Electronics Corporation. DICE (WAFER SAWN) - WAFFLE PACK. Key specifications: mounting type Surface Mount, operating temperature -40°C ~ 125°C (TA), package / case Die, current - supply 1.1 mA.

In Stock: 6,379

Product Attributes

AttributeValue
DigiKey Programmable-
TypeCapacitive Sensor
Input TypeAnalog, Digital
Output TypeI2C, Serial
Current - Supply1.1 mA
Operating Temperature-40°C ~ 125°C (TA)
Grade-
Qualification-
Mounting TypeSurface Mount
Package / CaseDie
Supplier Device PackageDie

Frequently Asked Questions

ZSSC3230BI1DES is a Interface - Sensor and Detector Interfaces manufactured by Renesas Electronics Corporation. DICE (WAFER SAWN) - WAFFLE PACK

The mounting type of ZSSC3230BI1DES is Surface Mount.

The operating temperature range of ZSSC3230BI1DES is -40°C ~ 125°C (TA).

The package type of ZSSC3230BI1DES is Die.

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