ZSSC3230BI1DES
Renesas Electronics Corporation
DICE (WAFER SAWN) - WAFFLE PACK
ZSSC3230BI1DES is a Interface - Sensor and Detector Interfaces manufactured by Renesas Electronics Corporation. DICE (WAFER SAWN) - WAFFLE PACK. Key specifications: mounting type Surface Mount, operating temperature -40°C ~ 125°C (TA), package / case Die, current - supply 1.1 mA.
In Stock: 6,379