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ZSSC3018BA1C - Renesas Electronics Corporation - Interface - Sensor and Detector Interfaces

ZSSC3018BA1C

Renesas Electronics Corporation

DICE (WAFER SAWN) - FRAME

ZSSC3018BA1C is a Interface - Sensor and Detector Interfaces manufactured by Renesas Electronics Corporation. DICE (WAFER SAWN) - FRAME. Key specifications: mounting type Surface Mount, operating temperature -40°C ~ 125°C (TA), package / case Die, current - supply 1.5 mA.

In Stock: 2,576

Product Attributes

AttributeValue
DigiKey Programmable-
TypeSignal Conditioner
Input TypeDifferential
Output TypeI2C, Serial, SPI
Current - Supply1.5 mA
Operating Temperature-40°C ~ 125°C (TA)
Grade-
Qualification-
Mounting TypeSurface Mount
Package / CaseDie
Supplier Device PackageDie

Frequently Asked Questions

ZSSC3018BA1C is a Interface - Sensor and Detector Interfaces manufactured by Renesas Electronics Corporation. DICE (WAFER SAWN) - FRAME

The mounting type of ZSSC3018BA1C is Surface Mount.

The operating temperature range of ZSSC3018BA1C is -40°C ~ 125°C (TA).

The package type of ZSSC3018BA1C is Die.

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