Renesas Electronics Corporation
SOC PLC MODEM LSI SMART GRID ASS
R9A06G037GNP#AA0 is a Embedded - System On Chip (SoC) manufactured by Renesas Electronics Corporation. SOC PLC MODEM LSI SMART GRID ASS. Key specifications: operating temperature -40°C ~ 85°C (TA), package / case 64-VFQFN Exposed Pad.
In Stock: 2,320
| Attribute | Value |
|---|---|
| Architecture | DSP, MCU |
| Core Processor | ARM® Cortex®-M3 |
| Flash Size | - |
| RAM Size | 128kB |
| Peripherals | PWM |
| Connectivity | CSI, I2C, UART |
| Speed | 138MHz |
| Primary Attributes | - |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Grade | - |
| Qualification | - |
| Package / Case | 64-VFQFN Exposed Pad |
| Supplier Device Package | 64-HVQFN (9x9) |
| Part Number | Manufacturer | Description | Match | |
|---|---|---|---|---|
| M2S090-FCS325I | Microchip Technology | IC SOC CORTEX-M3 166MHZ 325BGA | 83% | View |
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| M2S025TS-1VFG400T2 | Microchip Technology | IC SOC CORTEX-M3 166MHZ 400VFBGA | 83% | View |
| A2F500M3G-1FG484I | Microchip Technology | IC SOC CORTEX-M3 100MHZ 484FBGA | 71% | View |
| A2F200M3F-1FGG484I | Microchip Technology | IC SOC CORTEX-M3 100MHZ 484FBGA | 71% | View |
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