IC FPGA 260 I/O 572FBGA
EP2AGX125DF25I3 is a Embedded - FPGAs (Field Programmable Gate Array) manufactured by Intel. IC FPGA 260 I/O 572FBGA. Key specifications: mounting type Surface Mount, operating temperature -40°C ~ 100°C (TJ), voltage - supply 0.87V ~ 0.93V, package / case 572-BGA, FCBGA.
In Stock: 5,741
| Attribute | Value |
|---|---|
| Product Status | Obsolete |
| Number of LABs/CLBs | 4964 |
| Number of Logic Elements/Cells | 118143 |
| Total RAM Bits | 8315904 |
| Number of I/O | 260 |
| Number of Gates | - |
| Voltage - Supply | 0.87V ~ 0.93V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 572-BGA, FCBGA |
| Supplier Device Package | 572-FBGA, FC (25x25) |
EP2AGX125DF25I3 is Obsolete. Consider these compatible alternatives:
| Part Number | Manufacturer | Description | Match | |
|---|---|---|---|---|
| EP2AGX125DF25I3G | Intel | IC FPGA 260 I/O 572FBGA | 100% | View |
| EP2AGX125DF25I5G | Intel | IC FPGA 260 I/O 572FBGA | 100% | View |
| EP2AGX125EF29I3G | Intel | IC FPGA 372 I/O 780FBGA | 96% | View |
| EP3CLS200F484I7 | Intel | IC FPGA 210 I/O 484FBGA | 76% | View |
| EP3CLS200F484I7N | Intel | IC FPGA 210 I/O 484FBGA | 76% | View |
| EP3CLS200F780I7 | Intel | IC FPGA 413 I/O 780FBGA | 73% | View |
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