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IRAM336-025SB3 - Infineon Technologies - Power Driver Modules

IRAM336-025SB3

Infineon Technologies

IC HYBRID MULTI-CHIP 500V 2A

IRAM336-025SB3 is a Power Driver Modules manufactured by Infineon Technologies. IC HYBRID MULTI-CHIP 500V 2A. Key specifications: mounting type Through Hole, voltage 500 V, package / case 19-PowerSSIP Module, Formed Leads, current 2 A.

In Stock: 9,192

Product Attributes

AttributeValue
Product StatusObsolete
TypeMOSFET
Configuration3 Phase
Current2 A
Voltage500 V
Voltage - Isolation-
Mounting TypeThrough Hole
Package / Case19-PowerSSIP Module, Formed Leads

Frequently Asked Questions

IRAM336-025SB3 is a Power Driver Modules manufactured by Infineon Technologies. IC HYBRID MULTI-CHIP 500V 2A

The mounting type of IRAM336-025SB3 is Through Hole.

The supply voltage of IRAM336-025SB3 is 500 V.

The package type of IRAM336-025SB3 is 19-PowerSSIP Module, Formed Leads.

Yes, IRAM336-025SB3 is listed as Obsolete. Consider requesting a quote for alternative parts.

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