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HC5513BIM - Harris Corporation - Interface - Telecom

HC5513BIM

Harris Corporation

DLC/FLC SLIC

HC5513BIM is a Interface - Telecom manufactured by Harris Corporation. DLC/FLC SLIC. Key specifications: mounting type Through Hole, operating temperature -40°C ~ 85°C, package / case 22-DIP (0.400", 10.16mm), current - supply 2.25mA.

In Stock: 925

Product Attributes

AttributeValue
Product StatusObsolete
FunctionSubscriber Line Interface Concept (SLIC)
Interface-
Number of Circuits1
Voltage - Supply-
Current - Supply2.25mA
Power (Watts)1.5 W
Operating Temperature-40°C ~ 85°C
Mounting TypeThrough Hole
Package / Case22-DIP (0.400", 10.16mm)
Supplier Device Package22-PDIP

Frequently Asked Questions

HC5513BIM is a Interface - Telecom manufactured by Harris Corporation. DLC/FLC SLIC

The mounting type of HC5513BIM is Through Hole.

The operating temperature range of HC5513BIM is -40°C ~ 85°C.

The package type of HC5513BIM is 22-DIP (0.400", 10.16mm).

The circuit configuration of HC5513BIM is 1.

Alternative Products

HC5513BIM is Obsolete. Consider these compatible alternatives:

Part NumberManufacturerDescriptionMatch
M-959 IXYS Integrated Circuits Division IC TELECOM INTERFACE 14DIP 94% View
MT88L70AE1 Microchip Technology IC TELECOM INTERFACE 18DIP 94% View
ZL49020DAA1 Microchip Technology IC TELECOM INTERFACE 8DIP 84% View
MT3171BE1 Microchip Technology IC TELECOM INTERFACE 8DIP 84% View
MT8870DE1 Microchip Technology IC TELECOM INTERFACE 18DIP 84% View
ZL49021DAA1 Microchip Technology IC TELECOM INTERFACE 8DIP 84% View

Related Products

Manufacturers in Interface - Telecom

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