GigaDevice Semiconductor (HK) Limited
IC FLASH 16MBIT SPI/QUAD 8USON
GD25LQ16EEAGR is a Memory manufactured by GigaDevice Semiconductor (HK) Limited. IC FLASH 16MBIT SPI/QUAD 8USON. Key specifications: mounting type Surface Mount, operating temperature -40°C ~ 125°C (TA), voltage - supply 1.65V ~ 2.1V, package / case 8-XFDFN Exposed Pad.
In Stock: 1,607
| Attribute | Value |
|---|---|
| DigiKey Programmable | - |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NOR (SLC) |
| Memory Size | 16Mbit |
| Memory Organization | 2M x 8 |
| Memory Interface | SPI - Quad I/O, QPI |
| Clock Frequency | 133 MHz |
| Write Cycle Time - Word, Page | 100µs, 4ms |
| Access Time | 6 ns |
| Voltage - Supply | 1.65V ~ 2.1V |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Grade | - |
| Qualification | - |
| Mounting Type | Surface Mount |
| Package / Case | 8-XFDFN Exposed Pad |
| Supplier Device Package | 8-USON (3x2) |
| Part Number | Manufacturer | Description | Match | |
|---|---|---|---|---|
| S70FL01GSAGBHEC10 | Flip Electronics | IC FLASH 1GBIT SPI QUAD 24BGA | 92% | View |
| W25Q16JWZPSQ | Winbond Electronics | IC FLASH | 82% | View |
| W25Q16JWSNSQ | Winbond Electronics | IC FLASH | 82% | View |
| W25Q64JVSSSQ | Winbond Electronics | IC FLASH | 76% | View |
| W25Q16JVSNSM | Winbond Electronics | IC FLASH | 76% | View |
| W25Q64JVZESM | Winbond Electronics | IC FLASH | 76% | View |
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3J LIMITED
