GigaDevice Semiconductor (HK) Limited
IC FLASH 4MBIT SPI/QUAD 8SOP
GD25LE40ETIGR is a Memory manufactured by GigaDevice Semiconductor (HK) Limited. IC FLASH 4MBIT SPI/QUAD 8SOP. Key specifications: mounting type Surface Mount, operating temperature -40°C ~ 85°C (TA), voltage - supply 1.65V ~ 2V, package / case 8-SOIC (0.154", 3.90mm Width).
In Stock: 6,457
| Attribute | Value |
|---|---|
| DigiKey Programmable | - |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NOR (SLC) |
| Memory Size | 4Mbit |
| Memory Organization | 512K x 8 |
| Memory Interface | SPI - Quad I/O |
| Clock Frequency | 133 MHz |
| Write Cycle Time - Word, Page | 60µs, 2.4ms |
| Access Time | 6 ns |
| Voltage - Supply | 1.65V ~ 2V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Grade | - |
| Qualification | - |
| Mounting Type | Surface Mount |
| Package / Case | 8-SOIC (0.154", 3.90mm Width) |
| Supplier Device Package | 8-SOP |
| Part Number | Manufacturer | Description | Match | |
|---|---|---|---|---|
| GD25LQ40ESIGR | GigaDevice Semiconductor (HK) Limited | IC FLASH 4MBIT SPI/QUAD 8SOP | 100% | View |
| W29N01HVSINA TR | Winbond Electronics | 1G-BIT NAND FLASH, 3V, 1-BIT ECC | 82% | View |
| W25Q10EWSNIG TR | Winbond Electronics | SPIFLASH, 1.8V 1M-BIT, 4KB UNIFO | 82% | View |
| W25Q512NWEIM TR | Winbond Electronics | SPIFLASH, 512M-BIT, 1.8V, 4KB UN | 82% | View |
| W25Q16JVZPIM | Winbond Electronics | SPIFLASH, 3V, 16M-BIT, 4KB UNIFO | 76% | View |
| W25N512GVEIR TR | Winbond Electronics | 512MB SERIAL NAND FLASH, 3V | 67% | View |
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3J LIMITED
