GigaDevice Semiconductor (HK) Limited
IC FLASH 16MBIT SPI/QUAD 8WLCSP
GD25LE16E3IGR is a Memory manufactured by GigaDevice Semiconductor (HK) Limited. IC FLASH 16MBIT SPI/QUAD 8WLCSP. Key specifications: mounting type Surface Mount, operating temperature -40°C ~ 85°C (TA), voltage - supply 1.65V ~ 2V, package / case 8-XFBGA, WLCSP.
In Stock: 9,481
| Attribute | Value |
|---|---|
| DigiKey Programmable | - |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NOR (SLC) |
| Memory Size | 16Mbit |
| Memory Organization | 2M x 8 |
| Memory Interface | SPI - Quad I/O, QPI |
| Clock Frequency | 133 MHz |
| Write Cycle Time - Word, Page | 60µs, 2.4ms |
| Access Time | 6 ns |
| Voltage - Supply | 1.65V ~ 2V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Grade | - |
| Qualification | - |
| Mounting Type | Surface Mount |
| Package / Case | 8-XFBGA, WLCSP |
| Supplier Device Package | 8-WLCSP |
| Part Number | Manufacturer | Description | Match | |
|---|---|---|---|---|
| GD25LE80ELIGR | GigaDevice Semiconductor (HK) Limited | IC FLASH 8MBIT SPI/QUAD 16WLCSP | 100% | View |
| W25Q16JWSSAM | Winbond Electronics | IC FLASH | 82% | View |
| W25Q256JWCIM | Winbond Electronics | SPIFLASH, 1.8V, 256M-BIT, 4KB UN | 81% | View |
| W25Q64JWZPAQ | Winbond Electronics | IC FLASH | 81% | View |
| W25Q128JWFIM TR | Winbond Electronics | SPIFLASH, 128M-BIT, 4KB UNIFORM | 81% | View |
| W25Q64JVTBAM | Winbond Electronics | IC FLASH | 76% | View |
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