NEXT GENERATION BLE V5.0 ENCAPSU
EMBP01-F171-H3100 is a RF Transceiver Modules and Modems manufactured by EM Microelectronic. NEXT GENERATION BLE V5.0 ENCAPSU. Key specifications: mounting type Chassis Mount, operating temperature -20°C ~ 60°C, voltage - supply 2.3V ~ 3.6V, package / case Module.
In Stock: 70
| Attribute | Value |
|---|---|
| Product Status | Active |
| RF Family/Standard | Bluetooth |
| Protocol | Bluetooth v5.0 |
| Modulation | - |
| Frequency | 2.4GHz |
| Data Rate | - |
| Power - Output | 6dBm |
| Sensitivity | - |
| Serial Interfaces | - |
| Antenna Type | Antenna Not Included |
| Utilized IC / Part | - |
| Memory Size | - |
| Voltage - Supply | 2.3V ~ 3.6V |
| Current - Receiving | - |
| Current - Transmitting | - |
| Mounting Type | Chassis Mount |
| Operating Temperature | -20°C ~ 60°C |
| Package / Case | Module |
Submit your RFQ for EMBP01-F171-H3100 and get a quote within 24 hours.
3J LIMITED
