TSX713
REFLOW VACUUM TIP, HOLE DIA: 1.3
TSX713 is a Soldering, Desoldering, Rework Tips, Nozzles manufactured by EDSYN INCORPORATED. REFLOW VACUUM TIP, HOLE DIA: 1.3.
In Stock: 5
REFLOW VACUUM TIP, HOLE DIA: 1.3
TSX713 is a Soldering, Desoldering, Rework Tips, Nozzles manufactured by EDSYN INCORPORATED. REFLOW VACUUM TIP, HOLE DIA: 1.3.
In Stock: 5
| Attribute | Value |
|---|---|
| Product Status | Active |
| Tip Type | Rework |
| Tip Shape | Nozzle |
| Height | - |
| Width | - |
| Length | 0.551" (14.00mm) |
| Diameter | 0.051" (1.30mm) |
| Tip Chip Size | - |
| Temperature Range | - |
| For Use With/Related Products | - |
Submit your RFQ for TSX713 and get a quote within 24 hours.