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HSS19-B20-NP - CUI Devices - Thermal - Heat Sinks

HSS19-B20-NP

CUI Devices

HEAT SINK, STAMPING, TO-218/TO-2

HSS19-B20-NP is a Thermal - Heat Sinks manufactured by CUI Devices. HEAT SINK, STAMPING, TO-218/TO-2. Key specifications: material Aluminum Alloy.

In Stock: 2,988

Product Attributes

AttributeValue
Product StatusActive
TypeTop Mount
Package CooledTO-218, TO-220
Attachment MethodBolt On
ShapeRectangular, Fins
Length0.866" (22.00mm)
Width0.748" (19.00mm)
Diameter-
Fin Height0.748" (19.00mm)
Power Dissipation @ Temperature Rise3.35W @ 75°C
Thermal Resistance @ Forced Air Flow8.80°C/W @ 200 LFM
Thermal Resistance @ Natural22.39°C/W
MaterialAluminum Alloy
Material FinishBlack Anodized

Frequently Asked Questions

HSS19-B20-NP is a Thermal - Heat Sinks manufactured by CUI Devices. HEAT SINK, STAMPING, TO-218/TO-2

The material of HSS19-B20-NP is Aluminum Alloy.

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