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HSS08-B18-CP - CUI Devices - Thermal - Heat Sinks

HSS08-B18-CP

CUI Devices

HEAT SINK, STAMPING, TO-218, 44.

HSS08-B18-CP is a Thermal - Heat Sinks manufactured by CUI Devices. HEAT SINK, STAMPING, TO-218, 44.. Key specifications: material Aluminum Alloy.

In Stock: 990

Product Attributes

AttributeValue
Product StatusActive
TypeBoard Level, Vertical
Package CooledTO-218
Attachment MethodPC Pin
ShapeSquare
Length1.750" (44.45mm)
Width1.750" (44.45mm)
Diameter-
Fin Height0.492" (12.50mm)
Power Dissipation @ Temperature Rise10.3W @ 75°C
Thermal Resistance @ Forced Air Flow3.50°C/W @ 200 LFM
Thermal Resistance @ Natural7.29°C/W
MaterialAluminum Alloy
Material FinishBlack Anodized

Frequently Asked Questions

HSS08-B18-CP is a Thermal - Heat Sinks manufactured by CUI Devices. HEAT SINK, STAMPING, TO-218, 44.

The material of HSS08-B18-CP is Aluminum Alloy.

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