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HSS01-B20-CP - CUI Devices - Thermal - Heat Sinks

HSS01-B20-CP

CUI Devices

HEAT SINK, STAMPING, TO-220, 49.

HSS01-B20-CP is a Thermal - Heat Sinks manufactured by CUI Devices. HEAT SINK, STAMPING, TO-220, 49.. Key specifications: material Aluminum Alloy.

In Stock: 1,272

Product Attributes

AttributeValue
Product StatusActive
TypeBoard Level, Vertical
Package CooledTO-220
Attachment MethodBolt On and PC Pin
ShapeRectangular
Length1.941" (49.31mm)
Width1.900" (48.26mm)
Diameter-
Fin Height0.950" (24.13mm)
Power Dissipation @ Temperature Rise9.9W @ 75°C
Thermal Resistance @ Forced Air Flow3.70°C/W @ 200 LFM
Thermal Resistance @ Natural7.59°C/W
MaterialAluminum Alloy
Material FinishBlack Anodized

Frequently Asked Questions

HSS01-B20-CP is a Thermal - Heat Sinks manufactured by CUI Devices. HEAT SINK, STAMPING, TO-220, 49.

The material of HSS01-B20-CP is Aluminum Alloy.

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