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HSE08-505028 - CUI Devices - Thermal - Heat Sinks

HSE08-505028

CUI Devices

HEAT SINK, EXTRUSION, TO-218/TO-

HSE08-505028 is a Thermal - Heat Sinks manufactured by CUI Devices. HEAT SINK, EXTRUSION, TO-218/TO-. Key specifications: material Aluminum Alloy.

In Stock: 1,120

Product Attributes

AttributeValue
Product StatusActive
TypeBoard Level
Package CooledTO-218, TO-220
Attachment MethodClip
ShapeRectangular, Angled Fins
Length1.969" (50.00mm)
Width1.102" (28.00mm)
Diameter-
Fin Height1.969" (50.00mm)
Power Dissipation @ Temperature Rise10.53W @ 75°C
Thermal Resistance @ Forced Air Flow2.70°C/W @ 200 LFM
Thermal Resistance @ Natural7.13°C/W
MaterialAluminum Alloy
Material FinishBlack Anodized

Frequently Asked Questions

HSE08-505028 is a Thermal - Heat Sinks manufactured by CUI Devices. HEAT SINK, EXTRUSION, TO-218/TO-

The material of HSE08-505028 is Aluminum Alloy.

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