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HSE06-503045 - CUI Devices - Thermal - Heat Sinks

HSE06-503045

CUI Devices

HEAT SINK, EXTRUSION, TO-218/TO-

HSE06-503045 is a Thermal - Heat Sinks manufactured by CUI Devices. HEAT SINK, EXTRUSION, TO-218/TO-. Key specifications: material Aluminum Alloy.

In Stock: 1,200

Product Attributes

AttributeValue
Product StatusActive
TypeBoard Level
Package CooledTO-218, TO-220
Attachment MethodClip
ShapeRectangular, Fins
Length1.969" (50.00mm)
Width1.181" (30.00mm)
Diameter-
Fin Height1.772" (45.00mm)
Power Dissipation @ Temperature Rise12.79W @ 75°C
Thermal Resistance @ Forced Air Flow2.10°C/W @ 200 LFM
Thermal Resistance @ Natural5.86°C/W
MaterialAluminum Alloy
Material FinishBlack Anodized

Frequently Asked Questions

HSE06-503045 is a Thermal - Heat Sinks manufactured by CUI Devices. HEAT SINK, EXTRUSION, TO-218/TO-

The material of HSE06-503045 is Aluminum Alloy.

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