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HSE05-171933 - CUI Devices - Thermal - Heat Sinks

HSE05-171933

CUI Devices

HEAT SINK, EXTRUSION, TO-218/TO-

HSE05-171933 is a Thermal - Heat Sinks manufactured by CUI Devices. HEAT SINK, EXTRUSION, TO-218/TO-. Key specifications: material Aluminum Alloy.

In Stock: 3,230

Product Attributes

AttributeValue
Product StatusActive
TypeBoard Level
Package CooledTO-218, TO-220
Attachment MethodPC Pin
ShapeRectangular, Angled Fins
Length0.764" (19.40mm)
Width0.669" (17.00mm)
Diameter-
Fin Height1.280" (32.50mm)
Power Dissipation @ Temperature Rise3.98W @ 75°C
Thermal Resistance @ Forced Air Flow6.90°C/W @ 200 LFM
Thermal Resistance @ Natural18.83°C/W
MaterialAluminum Alloy
Material FinishBlack Anodized

Frequently Asked Questions

HSE05-171933 is a Thermal - Heat Sinks manufactured by CUI Devices. HEAT SINK, EXTRUSION, TO-218/TO-

The material of HSE05-171933 is Aluminum Alloy.

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