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HSE04-251265-2 - CUI Devices - Thermal - Heat Sinks

HSE04-251265-2

CUI Devices

HEAT SINK, EXTRUSION, TO-218/TO-

HSE04-251265-2 is a Thermal - Heat Sinks manufactured by CUI Devices. HEAT SINK, EXTRUSION, TO-218/TO-. Key specifications: material Aluminum Alloy.

In Stock: 2,982

Product Attributes

AttributeValue
Product StatusActive
TypeTop Mount
Package CooledTO-218, TO-220
Attachment MethodBolt On
ShapeRectangular, Fins
Length0.984" (25.00mm)
Width0.472" (12.00mm)
Diameter-
Fin Height0.256" (6.50mm)
Power Dissipation @ Temperature Rise2.47W @ 75°C
Thermal Resistance @ Forced Air Flow16.60°C/W @ 200 LFM
Thermal Resistance @ Natural30.38°C/W
MaterialAluminum Alloy
Material FinishBlack Anodized

Frequently Asked Questions

HSE04-251265-2 is a Thermal - Heat Sinks manufactured by CUI Devices. HEAT SINK, EXTRUSION, TO-218/TO-

The material of HSE04-251265-2 is Aluminum Alloy.

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