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HSE01-193175 - CUI Devices - Thermal - Heat Sinks

HSE01-193175

CUI Devices

HEAT SINK, EXTRUSION, 19 X 31.5

HSE01-193175 is a Thermal - Heat Sinks manufactured by CUI Devices. HEAT SINK, EXTRUSION, 19 X 31.5. Key specifications: material Aluminum Alloy.

In Stock: 1,584

Product Attributes

AttributeValue
Product StatusActive
TypeTop Mount
Package Cooled-
Attachment MethodThermal Tape, Adhesive (Not Included)
ShapeSquare, Angled Fins
Length0.748" (19.00mm)
Width0.748" (19.00mm)
Diameter-
Fin Height0.295" (7.50mm)
Power Dissipation @ Temperature Rise2.95W @ 75°C
Thermal Resistance @ Forced Air Flow9.20°C/W @ 200 LFM
Thermal Resistance @ Natural25.44°C/W
MaterialAluminum Alloy
Material FinishBlue Anodized

Frequently Asked Questions

HSE01-193175 is a Thermal - Heat Sinks manufactured by CUI Devices. HEAT SINK, EXTRUSION, 19 X 31.5

The material of HSE01-193175 is Aluminum Alloy.

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