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HSE-B250-04H - CUI Devices - Thermal - Heat Sinks

HSE-B250-04H

CUI Devices

HEAT SINK, EXTRUSION, TO-220, 25

HSE-B250-04H is a Thermal - Heat Sinks manufactured by CUI Devices. HEAT SINK, EXTRUSION, TO-220, 25. Key specifications: material Aluminum Alloy.

In Stock: 317

Product Attributes

AttributeValue
Product StatusActive
TypeBoard Level, Vertical
Package CooledTO-220
Attachment MethodBolt On and PC Pin
ShapeRectangular, Fins
Length0.984" (25.00mm)
Width1.378" (35.00mm)
Diameter-
Fin Height1.000" (25.40mm)
Power Dissipation @ Temperature Rise8.0W @ 75°C
Thermal Resistance @ Forced Air Flow3.26°C/W @ 200 LFM
Thermal Resistance @ Natural13.60°C/W
MaterialAluminum Alloy
Material FinishBlack Anodized

Frequently Asked Questions

HSE-B250-04H is a Thermal - Heat Sinks manufactured by CUI Devices. HEAT SINK, EXTRUSION, TO-220, 25

The material of HSE-B250-04H is Aluminum Alloy.

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