Same Sky (Formerly CUI Devices)
HEAT SINK, BGA, 25 X 25 X 9 MM,
HSB39-252509P is a Thermal - Heat Sinks manufactured by Same Sky (Formerly CUI Devices). HEAT SINK, BGA, 25 X 25 X 9 MM,. Key specifications: material Aluminum Alloy.
In Stock: 282
| Attribute | Value |
|---|---|
| Type | Top Mount |
| Package Cooled | BGA |
| Attachment Method | Push Pin |
| Shape | Square, Pin Fins |
| Length | 0.984" (25.00mm) |
| Width | 0.984" (25.00mm) |
| Diameter | - |
| Fin Height | 0.354" (9.00mm) |
| Power Dissipation @ Temperature Rise | 4.3W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 6.30°C/W @ 200 LFM |
| Thermal Resistance @ Natural | 17.53°C/W |
| Material | Aluminum Alloy |
| Material Finish | Black Anodized |
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