Same Sky (Formerly CUI Devices)
HEAT SINK, BGA, 27 X 27 X 25 MM,
HSB35-272725 is a Thermal - Heat Sinks manufactured by Same Sky (Formerly CUI Devices). HEAT SINK, BGA, 27 X 27 X 25 MM,. Key specifications: material Aluminum Alloy.
In Stock: 376
| Attribute | Value |
|---|---|
| Type | Top Mount |
| Package Cooled | BGA |
| Attachment Method | Adhesive (Not Included) |
| Shape | Square, Pin Fins |
| Length | 1.063" (27.00mm) |
| Width | 1.063" (27.00mm) |
| Diameter | - |
| Fin Height | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise | 8.6W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 2.90°C/W @ 200 LFM |
| Thermal Resistance @ Natural | 8.74°C/W |
| Material | Aluminum Alloy |
| Material Finish | Black Anodized |
Submit your RFQ for HSB35-272725 and get a quote within 24 hours.
3J LIMITED
