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HSB30-373710 - CUI Devices - Thermal - Heat Sinks

HSB30-373710

CUI Devices

HEAT SINK, BGA, 37.4 X 37 X 10 M

HSB30-373710 is a Thermal - Heat Sinks manufactured by CUI Devices. HEAT SINK, BGA, 37.4 X 37 X 10 M.

In Stock: 700

Product Attributes

AttributeValue
Product StatusActive
Type-
Package Cooled-
Attachment Method-
Shape-
Length-
Width-
Diameter-
Fin Height-
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow-
Thermal Resistance @ Natural-
Material-
Material Finish-

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Manufacturers in Thermal - Heat Sinks

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