3J LIMITED
HSB28-606022
HEAT SINK, BGA, 60 X 60 X 22 MM,
HSB28-606022 is a Thermal - Heat Sinks manufactured by CUI Devices. HEAT SINK, BGA, 60 X 60 X 22 MM,.
In Stock: 234
Product Attributes
| Attribute | Value |
|---|---|
| Product Status | Active |
| Type | - |
| Package Cooled | - |
| Attachment Method | - |
| Shape | - |
| Length | - |
| Width | - |
| Diameter | - |
| Fin Height | - |
| Power Dissipation @ Temperature Rise | - |
| Thermal Resistance @ Forced Air Flow | - |
| Thermal Resistance @ Natural | - |
| Material | - |
| Material Finish | - |
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