3J LIMITED
HSB25-282810
HEAT SINK, BGA, 28.5 X 28.5 X 10
HSB25-282810 is a Thermal - Heat Sinks manufactured by CUI Devices. HEAT SINK, BGA, 28.5 X 28.5 X 10. Key specifications: material Aluminum Alloy.
In Stock: 1,708
Product Attributes
| Attribute | Value |
|---|---|
| Product Status | Active |
| Type | Top Mount |
| Package Cooled | BGA |
| Attachment Method | Push Pin |
| Shape | Square, Pin Fins |
| Length | 1.122" (28.50mm) |
| Width | 1.122" (28.50mm) |
| Diameter | - |
| Fin Height | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise | 4.87W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 5.10°C/W @ 200 LFM |
| Thermal Resistance @ Natural | 15.41°C/W |
| Material | Aluminum Alloy |
| Material Finish | Black Anodized |
Frequently Asked Questions
HSB25-282810 is a Thermal - Heat Sinks manufactured by CUI Devices. HEAT SINK, BGA, 28.5 X 28.5 X 10
The material of HSB25-282810 is Aluminum Alloy.
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