3J LIMITED
HSB13-303014
HEAT SINK, BGA, 30.7 X 30.7 X 14
HSB13-303014 is a Thermal - Heat Sinks manufactured by CUI Devices. HEAT SINK, BGA, 30.7 X 30.7 X 14. Key specifications: material Aluminum Alloy.
In Stock: 532
Product Attributes
| Attribute | Value |
|---|---|
| Product Status | Active |
| Type | Top Mount |
| Package Cooled | BGA |
| Attachment Method | Adhesive |
| Shape | Square, Pin Fins |
| Length | 1.209" (30.70mm) |
| Width | 1.209" (30.70mm) |
| Diameter | - |
| Fin Height | 0.551" (14.00mm) |
| Power Dissipation @ Temperature Rise | 6.1W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 4.70°C/W @ 200 LFM |
| Thermal Resistance @ Natural | 12.36°C/W |
| Material | Aluminum Alloy |
| Material Finish | Black Anodized |
Frequently Asked Questions
HSB13-303014 is a Thermal - Heat Sinks manufactured by CUI Devices. HEAT SINK, BGA, 30.7 X 30.7 X 14
The material of HSB13-303014 is Aluminum Alloy.
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