3J LIMITED
HSB11-252518
HEAT SINK, BGA, 25 X 25 X 18 MM
HSB11-252518 is a Thermal - Heat Sinks manufactured by CUI Devices. HEAT SINK, BGA, 25 X 25 X 18 MM. Key specifications: material Aluminum Alloy.
In Stock: 1,514
Product Attributes
| Attribute | Value |
|---|---|
| Product Status | Active |
| Type | Top Mount |
| Package Cooled | BGA |
| Attachment Method | Adhesive |
| Shape | Square, Pin Fins |
| Length | 0.984" (25.00mm) |
| Width | 0.984" (25.00mm) |
| Diameter | - |
| Fin Height | 0.709" (18.00mm) |
| Power Dissipation @ Temperature Rise | 5.5W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 4.50°C/W @ 200 LFM |
| Thermal Resistance @ Natural | 13.70°C/W |
| Material | Aluminum Alloy |
| Material Finish | Black Anodized |
Frequently Asked Questions
HSB11-252518 is a Thermal - Heat Sinks manufactured by CUI Devices. HEAT SINK, BGA, 25 X 25 X 18 MM
The material of HSB11-252518 is Aluminum Alloy.
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