3J LIMITED
HSB02-101007
HEAT SINK, BGA, 10 X 10 X 7 MM
HSB02-101007 is a Thermal - Heat Sinks manufactured by CUI Devices. HEAT SINK, BGA, 10 X 10 X 7 MM. Key specifications: material Aluminum Alloy.
In Stock: 279
Product Attributes
| Attribute | Value |
|---|---|
| Product Status | Active |
| Type | Top Mount |
| Package Cooled | BGA |
| Attachment Method | Adhesive |
| Shape | Square, Pin Fins |
| Length | 0.394" (10.00mm) |
| Width | 0.394" (10.00mm) |
| Diameter | - |
| Fin Height | 0.275" (7.00mm) |
| Power Dissipation @ Temperature Rise | 2.0W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 16.50°C/W @ 200 LFM |
| Thermal Resistance @ Natural | 37.90°C/W |
| Material | Aluminum Alloy |
| Material Finish | Black Anodized |
Frequently Asked Questions
HSB02-101007 is a Thermal - Heat Sinks manufactured by CUI Devices. HEAT SINK, BGA, 10 X 10 X 7 MM
The material of HSB02-101007 is Aluminum Alloy.
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