CTS Thermal Management Products
HEATSINK CPU W/ADHESIVE 1.31"SQ
BDN13-3CB/A01 is a Thermal - Heat Sinks manufactured by CTS Thermal Management Products. HEATSINK CPU W/ADHESIVE 1.31"SQ. Key specifications: material Aluminum.
In Stock: 403
| Attribute | Value |
|---|---|
| Product Status | Active |
| Type | Top Mount |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method | Thermal Tape, Adhesive (Included) |
| Shape | Square, Pin Fins |
| Length | 1.310" (33.27mm) |
| Width | 1.310" (33.27mm) |
| Diameter | - |
| Fin Height | 0.355" (9.02mm) |
| Power Dissipation @ Temperature Rise | - |
| Thermal Resistance @ Forced Air Flow | 6.00°C/W @ 400 LFM |
| Thermal Resistance @ Natural | 16.10°C/W |
| Material | Aluminum |
| Material Finish | Black Anodized |
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3J LIMITED
