CTS Thermal Management Products
HEATSINK CPU W/ADHESIVE 1.11"SQ
BDN11-3CB/A01 is a Thermal - Heat Sinks manufactured by CTS Thermal Management Products. HEATSINK CPU W/ADHESIVE 1.11"SQ. Key specifications: material Aluminum.
In Stock: 3,310
| Attribute | Value |
|---|---|
| Product Status | Active |
| Type | Top Mount |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method | Thermal Tape, Adhesive (Included) |
| Shape | Square, Pin Fins |
| Length | 1.110" (28.19mm) |
| Width | 1.110" (28.19mm) |
| Diameter | - |
| Fin Height | 0.355" (9.02mm) |
| Power Dissipation @ Temperature Rise | - |
| Thermal Resistance @ Forced Air Flow | 7.20°C/W @ 400 LFM |
| Thermal Resistance @ Natural | 20.90°C/W |
| Material | Aluminum |
| Material Finish | Black Anodized |
Submit your RFQ for BDN11-3CB/A01 and get a quote within 24 hours.
3J LIMITED
