3J LIMITED
BDN09-3CB
CTS Thermal Management Products
HEATSINK CPU .91" SQ
BDN09-3CB is a Thermal - Heat Sinks manufactured by CTS Thermal Management Products. HEATSINK CPU .91" SQ. Key specifications: material Aluminum.
In Stock: 1,346
Product Attributes
| Attribute | Value |
|---|---|
| Product Status | Active |
| Type | Top Mount |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method | Thermal Tape, Adhesive (Not Included) |
| Shape | Square, Pin Fins |
| Length | 0.910" (23.11mm) |
| Width | 0.910" (23.11mm) |
| Diameter | - |
| Fin Height | 0.355" (9.02mm) |
| Power Dissipation @ Temperature Rise | - |
| Thermal Resistance @ Forced Air Flow | 9.60°C/W @ 400 LFM |
| Thermal Resistance @ Natural | 26.90°C/W |
| Material | Aluminum |
| Material Finish | Black Anodized |
Frequently Asked Questions
BDN09-3CB is a Thermal - Heat Sinks manufactured by CTS Thermal Management Products. HEATSINK CPU .91" SQ
The material of BDN09-3CB is Aluminum.
Related Products
Manufacturers in Thermal - Heat Sinks
Need a Quote for This Part?
Submit your RFQ for BDN09-3CB and get a quote within 24 hours.