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Product Attributes

AttributeValue
Product StatusActive
TypeTop Mount
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Attachment MethodThermal Tape, Adhesive (Not Included)
ShapeSquare, Fins
Length1.181" (30.00mm)
Width1.181" (30.00mm)
Diameter-
Fin Height0.250" (6.35mm)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow4.40°C/W @ 200 LFM
Thermal Resistance @ Natural-
MaterialAluminum
Material FinishBlack Anodized

Frequently Asked Questions

APF30-30-06CB is a Thermal - Heat Sinks manufactured by CTS Thermal Management Products. HEATSINK LOW-PROFILE FORGED

The material of APF30-30-06CB is Aluminum.

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