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TS391SNL500C - Chip Quik Inc. - Solder

TS391SNL500C

Chip Quik Inc.

THERMALLY STABLE SOLDER PASTE NO

TS391SNL500C is a Solder manufactured by Chip Quik Inc.. THERMALLY STABLE SOLDER PASTE NO.

In Stock: 4

Product Attributes

AttributeValue
Product StatusActive
TypeSolder Paste
CompositionSn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter-
Melting Point423 ~ 428°F (217 ~ 220°C)
Flux TypeNo-Clean
Wire Gauge-
Mesh Type4
ProcessLead Free
FormCartridge, 17.64 oz (500g)
Shelf Life12 Months
Shelf Life StartDate of Manufacture
Storage/Refrigeration Temperature68°F ~ 77°F (20°C ~ 25°C)

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