TC3-1G
HEAT SINK THERMAL COMPOUND
TC3-1G is a Thermal - Adhesives, Epoxies, Greases, Pastes manufactured by Chip Quik Inc.. HEAT SINK THERMAL COMPOUND. Key specifications: color Gray, size / dimension 1 gram Syringe.
In Stock: 7,521
HEAT SINK THERMAL COMPOUND
TC3-1G is a Thermal - Adhesives, Epoxies, Greases, Pastes manufactured by Chip Quik Inc.. HEAT SINK THERMAL COMPOUND. Key specifications: color Gray, size / dimension 1 gram Syringe.
In Stock: 7,521
| Attribute | Value |
|---|---|
| Product Status | Active |
| Type | Silicone Compound |
| Size / Dimension | 1 gram Syringe |
| Usable Temperature Range | -40°F ~ 302°F (-40°C ~ 150°C) |
| Color | Gray |
| Thermal Conductivity | 8.50W/m-K |
| Features | - |
| Shelf Life | 60 Months |
| Storage/Refrigeration Temperature | 37°F ~ 77°F (3°C ~ 25°C) |
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