TC1-20G
HEAT SINK COMPOUND - HIGH DENSIT
TC1-20G is a Thermal - Adhesives, Epoxies, Greases, Pastes manufactured by Chip Quik Inc.. HEAT SINK COMPOUND - HIGH DENSIT. Key specifications: color White, size / dimension 20 gram Syringe.
In Stock: 23
HEAT SINK COMPOUND - HIGH DENSIT
TC1-20G is a Thermal - Adhesives, Epoxies, Greases, Pastes manufactured by Chip Quik Inc.. HEAT SINK COMPOUND - HIGH DENSIT. Key specifications: color White, size / dimension 20 gram Syringe.
In Stock: 23
| Attribute | Value |
|---|---|
| Product Status | Active |
| Type | Silicone Compound |
| Size / Dimension | 20 gram Syringe |
| Usable Temperature Range | - |
| Color | White |
| Thermal Conductivity | 0.67W/m-K |
| Features | - |
| Shelf Life | 60 Months |
| Storage/Refrigeration Temperature | 37°F ~ 77°F (3°C ~ 25°C) |
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