TSSOP-64-EXP-PAD TO DIP-64 SMT
PA0196 is a Adapter, Breakout Boards manufactured by Chip Quik Inc.. TSSOP-64-EXP-PAD TO DIP-64 SMT. Key specifications: material FR4 Epoxy Glass, size / dimension 1.000" x 3.200" (25.40mm x 81.28mm), number of positions 64, pitch 0.020" (0.50mm).
In Stock: 4,158
| Attribute | Value |
|---|---|
| Product Status | Active |
| Proto Board Type | SMD to DIP |
| Package Accepted | TSSOP |
| Number of Positions | 64 |
| Pitch | 0.020" (0.50mm) |
| Board Thickness | 0.062" (1.57mm) 1/16" |
| Material | FR4 Epoxy Glass |
| Size / Dimension | 1.000" x 3.200" (25.40mm x 81.28mm) |
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3J LIMITED
