TSSOP-28-EXP-PAD TO DIP-28 SMT
PA0195 is a Adapter, Breakout Boards manufactured by Chip Quik Inc.. TSSOP-28-EXP-PAD TO DIP-28 SMT. Key specifications: material FR4 Epoxy Glass, size / dimension 1.000" x 1.400" (25.40mm x 35.56mm), number of positions 28, pitch 0.026" (0.65mm).
In Stock: 293
| Attribute | Value |
|---|---|
| Product Status | Active |
| Proto Board Type | SMD to DIP |
| Package Accepted | TSSOP |
| Number of Positions | 28 |
| Pitch | 0.026" (0.65mm) |
| Board Thickness | 0.062" (1.57mm) 1/16" |
| Material | FR4 Epoxy Glass |
| Size / Dimension | 1.000" x 1.400" (25.40mm x 35.56mm) |
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3J LIMITED
