TO-263-9 DDPAK/D2PAK TO DIP-18 S
PA0187 is a Adapter, Breakout Boards manufactured by Chip Quik Inc.. TO-263-9 DDPAK/D2PAK TO DIP-18 S. Key specifications: material FR4 Epoxy Glass, size / dimension 0.700" x 1.000" (17.78mm x 25.40mm), number of positions 9, pitch 0.038" (0.97mm).
In Stock: 6,734
| Attribute | Value |
|---|---|
| Product Status | Active |
| Proto Board Type | SMD to DIP |
| Package Accepted | TO-263 (DDPAK/D2PAK) |
| Number of Positions | 9 |
| Pitch | 0.038" (0.97mm) |
| Board Thickness | 0.062" (1.57mm) 1/16" |
| Material | FR4 Epoxy Glass |
| Size / Dimension | 0.700" x 1.000" (17.78mm x 25.40mm) |
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3J LIMITED
