TO-263-7 DDPAK/D2PAK TO DIP-14
PA0186 is a Adapter, Breakout Boards manufactured by Chip Quik Inc.. TO-263-7 DDPAK/D2PAK TO DIP-14. Key specifications: material FR4 Epoxy Glass, size / dimension 0.700" x 0.700" (17.78mm x 17.78mm), number of positions 7, pitch 0.050" (1.27mm).
In Stock: 33
| Attribute | Value |
|---|---|
| Product Status | Active |
| Proto Board Type | SMD to DIP |
| Package Accepted | TO-263 (DDPAK/D2PAK) |
| Number of Positions | 7 |
| Pitch | 0.050" (1.27mm) |
| Board Thickness | 0.062" (1.57mm) 1/16" |
| Material | FR4 Epoxy Glass |
| Size / Dimension | 0.700" x 0.700" (17.78mm x 17.78mm) |
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3J LIMITED
