TO-263-3 DDPAK/D2PAK TO DIP-6 SM
PA0184 is a Adapter, Breakout Boards manufactured by Chip Quik Inc.. TO-263-3 DDPAK/D2PAK TO DIP-6 SM. Key specifications: material FR4 Epoxy Glass, size / dimension 0.700" x 0.300" (17.78mm x 7.62mm), number of positions 3, pitch 0.100" (2.54mm).
In Stock: 8
| Attribute | Value |
|---|---|
| Product Status | Active |
| Proto Board Type | SMD to DIP |
| Package Accepted | TO-263 (DDPAK/D2PAK) |
| Number of Positions | 3 |
| Pitch | 0.100" (2.54mm) |
| Board Thickness | 0.062" (1.57mm) 1/16" |
| Material | FR4 Epoxy Glass |
| Size / Dimension | 0.700" x 0.300" (17.78mm x 7.62mm) |
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3J LIMITED
