MINI SOIC-10 EXP PAD TO DIP-10 S
PA0171 is a Adapter, Breakout Boards manufactured by Chip Quik Inc.. MINI SOIC-10 EXP PAD TO DIP-10 S. Key specifications: material FR4 Epoxy Glass, size / dimension 0.700" x 0.500" (17.78mm x 12.70mm), number of positions 10, pitch 0.020" (0.50mm).
In Stock: 3,805
| Attribute | Value |
|---|---|
| Product Status | Active |
| Proto Board Type | SMD to DIP |
| Package Accepted | MiniSOIC EP |
| Number of Positions | 10 |
| Pitch | 0.020" (0.50mm) |
| Board Thickness | 0.062" (1.57mm) 1/16" |
| Material | FR4 Epoxy Glass |
| Size / Dimension | 0.700" x 0.500" (17.78mm x 12.70mm) |
Submit your RFQ for PA0171 and get a quote within 24 hours.
3J LIMITED
