MINI SOIC-8 EXP PAD TO DIP-8 SMT
PA0170C is a Adapter, Breakout Boards manufactured by Chip Quik Inc.. MINI SOIC-8 EXP PAD TO DIP-8 SMT. Key specifications: size / dimension 0.400" L x 0.400" W (10.16mm x 10.16mm), number of positions 8, pitch 0.026" (0.65mm).
In Stock: 6
| Attribute | Value |
|---|---|
| Proto Board Type | SMD to DIP |
| Package Accepted | MiniSOIC |
| Number of Positions | 8 |
| Pitch | 0.026" (0.65mm) |
| Board Thickness | - |
| Material | - |
| Size / Dimension | 0.400" L x 0.400" W (10.16mm x 10.16mm) |
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3J LIMITED
