MINI SOIC-8 EXP PAD TO DIP-8 SMT
PA0170 is a Adapter, Breakout Boards manufactured by Chip Quik Inc.. MINI SOIC-8 EXP PAD TO DIP-8 SMT. Key specifications: material FR4 Epoxy Glass, size / dimension 0.700" x 0.400" (17.78mm x 10.16mm), number of positions 8, pitch 0.026" (0.65mm).
In Stock: 3,538
| Attribute | Value |
|---|---|
| Product Status | Active |
| Proto Board Type | SMD to DIP |
| Package Accepted | MiniSOIC EP |
| Number of Positions | 8 |
| Pitch | 0.026" (0.65mm) |
| Board Thickness | 0.062" (1.57mm) 1/16" |
| Material | FR4 Epoxy Glass |
| Size / Dimension | 0.700" x 0.400" (17.78mm x 10.16mm) |
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3J LIMITED
