CSP-20/TCSP-20/UCSP-20 TO DIP-20
PA0119 is a Adapter, Breakout Boards manufactured by Chip Quik Inc.. CSP-20/TCSP-20/UCSP-20 TO DIP-20. Key specifications: material FR4 Epoxy Glass, size / dimension 0.700" x 1.000" (17.78mm x 25.40mm), number of positions 20, pitch 0.020" (0.50mm).
In Stock: 7,071
| Attribute | Value |
|---|---|
| Product Status | Active |
| Proto Board Type | SMD to DIP |
| Package Accepted | CSP, TCSP, UCSP |
| Number of Positions | 20 |
| Pitch | 0.020" (0.50mm) |
| Board Thickness | 0.062" (1.57mm) 1/16" |
| Material | FR4 Epoxy Glass |
| Size / Dimension | 0.700" x 1.000" (17.78mm x 25.40mm) |
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3J LIMITED
