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PA0026C - Chip Quik Inc. - Adapter, Breakout Boards

PA0026C

Chip Quik Inc.

UMAX-8/USOP-8/MSOP-8 TO DIP-8 SM

PA0026C is a Adapter, Breakout Boards manufactured by Chip Quik Inc.. UMAX-8/USOP-8/MSOP-8 TO DIP-8 SM. Key specifications: material FR4 Epoxy Glass, size / dimension 0.400" L x 0.400" W (10.16mm x 10.16mm), number of positions 8, pitch 0.026" (0.65mm).

In Stock: 41

Product Attributes

AttributeValue
Product StatusActive
Proto Board TypeSMD to DIP
Package AcceptedMSOP, uMAX, uSOP
Number of Positions8
Pitch0.026" (0.65mm)
Board Thickness0.063" (1.60mm)
MaterialFR4 Epoxy Glass
Size / Dimension0.400" L x 0.400" W (10.16mm x 10.16mm)

Frequently Asked Questions

PA0026C is a Adapter, Breakout Boards manufactured by Chip Quik Inc.. UMAX-8/USOP-8/MSOP-8 TO DIP-8 SM

The material of PA0026C is FR4 Epoxy Glass.

The size of PA0026C is 0.400" L x 0.400" W (10.16mm x 10.16mm).

The number of positions of PA0026C is 8.

The pitch of PA0026C is 0.026" (0.65mm).

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